Introduction to Technical Seminar Presentation on Polymer On Chip:

The paper is about implementation of polymer on chip.  The main aim of improving the chip includes the cost reduction, also increase in the package density so that it results in performance increase and also reliability. As discussed that it improves the performance, this can be done by reducing the length of the connection and also no extra area is needed for contacting on sides of components.

The process of polymer chip includes soldering joining, thermo compression join and thermo sonic join. Where the soldering is a process of joining of work pieces joined together with a metal so that only metal can metal but not the work pieces. Whereas the thermo compression join includes heat compression force on metals and thermosonic join includes the heat compression force with ultrasonic vibration.

Limitations of the implementation includes high accuracy achievement in the process, handling the chips is very difficult and also availability of bumped chip and also the repairing process is not possible. The complexity also involves in testing of the bare chips.

The advantages of this implementation includes the reduced cost and lower size, increase in the performance by reducing the length of the connection and provides the reliability and also increases the functionality and capable of improving the thermal capabilities.

We can conclude that the polymer chip is used for coupling API 3000 spectrometer. The device is also used for conducting proteomic research and also the characteristics of PDs does not degrade in the fabrication and the future fabrication can be done in both ways of electrical and optical polymer. The main aim of improving the chip includes the cost reduction, also increase in the package density so that it results in performance increase and also reliability.

 Download  Technical Seminar Presentation on Polymer On Chip with PPT for ECE Final Year Students.