Category: EEE seminar topics

Introduction to Sub-cycle Over current Protection For Self-clearing Fault Technical Seminar Presentation:

The paper provides a method for the sub-cycle over-current protection in order to ensure self-clearing faults. The paper also includes the phenomenon of self-clearing faults. It also includes the protection scheme algorithm and also covers testing. And also covers both the algorithms of symmetric and asymmetric.

The self-clearing faults, the characteristics of the fault includes, faults in a quarter cycle in case of self-clearance. They mostly occur at the voltage peak also the frequency occurrences will increase over a period of time.

The paper describes in detail about the fault, the causes of the fault, the need for the protection and also the events which lead for detection of self-clearing fault.

They depend on a property which includes the sensitivity, the speed, the selectivity and also the reliability. The architecture includes the application diagram, the scheme structure, the virtual test set, the multiple function specification Oscilography, Human-Machine interface, and the troubleshooting and outage analysis.

When testing is considered, the relay will operate in correct manner for clearance of fault. The relay remains as inoperative to the zone. The short circuit test involves the Making capacity test and also the Braking capacity test.

It also includes the protection scheme algorithm and also covers testing. And also covers both the algorithms of symmetric and asymmetric. The time for detection of fault is less, also the implementation of the software for the testing of the relay.

We can conclude that the paper includes the phenomenon of self-clearing faults. It also includes the protection scheme algorithm and also covers testing. And also covers both the algorithms of symmetric and asymmetric.

Download  Sub-cycle Over current Protection For Self-clearing Fault EEE Technical Seminar Presentation PPT.

Introduction to Technical Seminar Presentation on Dynamic Power Management for Embedded System:

The paper is about implementation of the dynamic power management system. This system refers to the power management being implemented when the programs are running or being executed. This type of the approach is based on the application requirements and also to satisfy the present and future processors capabilities.

The power management will communicate with DPM in the following ways, one as an application and other as the set of policies. Its implementation is done in the kernel of an operating system.

The policy managers are considered as an executable program which is responsible for activating the policies by their names. These managers responsibility is to implement both the user defined and also the application specific management strategies. They can be executed in many ways as part of the kernel or can be executed in the user space based on the strategy.

The operating point describes the parameters which includes the voltage, CPU bus frequencies and also the different states of the peripheral devices.

The power management system refers to the managing of the system when the programs are being executed or when they are being running. The implementation is done in the kernel of an operating system. And the policy managers are even responsible for their implementation.

The policy manager will gather information for all the sources like the operating system, also the user performances, the configuration files and also the running programs.

This paper is about implementation of power management which is dynamic. This system refers to the power management being implemented when the programs are running or being executed. This type of the approach is based on the application requirements

Download  EEE Technical Seminar Presentation on Dynamic Power Management for Embedded System.

Introduction to Technical Seminar Presentation on Silicon in Photonics:

The paper is about silicon photonics. The aim is developing bolt-and-go optical components by using silicon. As silicon is opaque in the visibility spectrum and appears to be transparent at infrared wavelengths when used in the optical transmission so that it can guide light.

It can be considered as an alternative or as a replacement for semiconductor-based photonics. WDM it meets all the requirements of optical data. The implementation of silicon based emitter is under process, until efficient silicon based emitter is available, the photonic integrated system have to use material light emitter.

For the laser to generate the light with a specific wavelength, the light needs to be filtered using grating, which is responsible for setting of wavelengths in a direction. The wavelengths selection for the communication needs to select and should be directed towards the other components of photons.

We can conclude that the silicon modulators which are operating at 2.5 GHz has experienced two orders of magnitude improvement when compared to that of si-based modulators, with theoretical modelling techniques which indicates the performance capabilities more than  10 GHz.  And also the initial results which are obtained for SiGe photo detectors has resulted in the feasibility of integrated detectors by further research and demonstration of silicon based photonic devices.

We can conclude that it can be considered as an alternative or as a replacement for semiconductor-based photonics. Silicon is opaque in the visibility spectrum and appears to be transparent at infrared wavelengths when used in the optical transmission so that it can guide light.

Download  Technical Seminar Presentation on Silicon in Photonics with PPT for EI Students. 

Introduction to Technical Seminar Presentation on Private Branch Exchange:

The paper is about private branch exchange, it means routing the calls between the caller and receiver. It is basically a device which is used for switching the telephonic calls with

 in the same building like office or a block.

In the earlier days, there used to be an attendant and his duty is connecting the calls manually between the caller and the receiver i.e. the person who is being called and all this is done manually by physically inserting a card.

In the present system proposes an automation of services of the PBX. Where the services are computerized i.e. PABX is implemented which is an automated version of PBX. By using the PABX performance increases because more telephonic calls can be handled at a time. I.e. it provides faster communication.

There are various generation of PBX implementation. The features of the Fifth Generation include usage of broadband digital switching and also the transmission is via the optics. It provides the features of integrated voice, data and also video. And also optical switching is integrated.

The functionality of PBX is used for providing the communication to number of users within a group or the same building. The architecture of PBXs resembles a star network with the central switching unit connected to all the devices.

We can conclude that the overall functionality of PBX is simple.  It can serve as a gateway for communication of data to longer distances. As this implementation is experiment type the dialing number is limited to a single digit therefore these are to be made before they are actual being used in public places. Thus we can conclude it as the effective device for providing communication.

Download  Technical Seminar Presentation on Private Branch Exchange with PPT for ECE Students.

Introduction to Technical Seminar Presentation on Polymer On Chip:

The paper is about implementation of polymer on chip.  The main aim of improving the chip includes the cost reduction, also increase in the package density so that it results in performance increase and also reliability. As discussed that it improves the performance, this can be done by reducing the length of the connection and also no extra area is needed for contacting on sides of components.

The process of polymer chip includes soldering joining, thermo compression join and thermo sonic join. Where the soldering is a process of joining of work pieces joined together with a metal so that only metal can metal but not the work pieces. Whereas the thermo compression join includes heat compression force on metals and thermosonic join includes the heat compression force with ultrasonic vibration.

Limitations of the implementation includes high accuracy achievement in the process, handling the chips is very difficult and also availability of bumped chip and also the repairing process is not possible. The complexity also involves in testing of the bare chips.

The advantages of this implementation includes the reduced cost and lower size, increase in the performance by reducing the length of the connection and provides the reliability and also increases the functionality and capable of improving the thermal capabilities.

We can conclude that the polymer chip is used for coupling API 3000 spectrometer. The device is also used for conducting proteomic research and also the characteristics of PDs does not degrade in the fabrication and the future fabrication can be done in both ways of electrical and optical polymer. The main aim of improving the chip includes the cost reduction, also increase in the package density so that it results in performance increase and also reliability.

 Download  Technical Seminar Presentation on Polymer On Chip with PPT for ECE Final Year Students.

Introduction to Technical Seminar Presentation on Light Emitting Polymers:

The paper is about light emitting polymers .where LEP is a technology which emits light based on the electrical operation performed. LEP, it exhibits the electro luminescent features. The concept of LEP was started in early 1990’s. The emission of light is due to the electric field application.

The conduction of the polymers includes a conductor, semiconductor and insulator. Conductor is used for conducting the electric current. It allows the flow of electric current through it equally in all directions and the flow of the current depends upon the amount of the resistance of the conductor and also the amount of voltage applied.

The semiconductor allows the flow of electric current in only one direction and weakly in other direction. The flow of current depends partially on amount of voltage but mostly depend on forward and backward resistance. Whereas the insulators do not conduct electricity i.e. they are the very bad conductors of the electricity.

The structure of LEP includes an anode, cathode and a thin film of polymer. Generally metals can be used as cathode and tin oxide can be used as anode, whereas the thin film of polymer is used in between cathode and an anode. The implementation is as follows, initially an electric field is applied between the electrodes and the electrons are then injected from cathode and anode and also the injected charges are combined again.

The advantage of the LEP includes the lowest consumption of the energy, it is an easy to use technology and it supports all the future requirements and provides flexible lighting and also provides large area lighting.

We can conclude that LEP implementation is easy and cost effective. It provides flexible lighting and it is a technology of present and even supports the future.

Download  Technical Seminar Presentation for ECE Students on Light Emitting Polymers with PPT.

Introduction to Transmeta Crusoe Processors Seminar Topic:

For the mobile devices the new processor was invented for faster processing in latest mobile devices. This microprocessor is invented by the Startup Company of Silicon Valley called Transmeta Corporation. Comparing PC microprocessors they become very heat when they are overloaded and for cooling purpose fans are used. The concept of TC processors is extracted from amoeba. It contains segmentation.

Based on the process how hardware and software must be known this all gained from amoeba. The Crusoe was concept based hybrid microprocessor that has hardware unit and software unit and hardware unit under the hardware components.The Crusoe microprocessor was fabricated using CMOS processwhich uses 128-bit architecture technique.

he chip design was based on the technology VLIW. The processor integrated and available in different versions.The developers have coupled both the x86 instruction set architecture (ISA) from the Processor below lying hardware. VLIW is very long instruction word to ensure design simplicity and to gain high performance. The software which is under the Oscan be simultaneously changed without effecting x86 architecture.

The CPU design needs a Latest version of code morphing technique for the translation of the x 86 instructions for the latest CPU. This Transmeta processor has two patents namely morphing and long run power management.

Download  Transmeta Crusoe Processors ECE Seminar Idea for Final Year Students.

Introduction to Orthogonal Frequency Division Multiplexing:

The use of movable communication system was increased tremendously like mobiles PDA’S etc. In this communication only low bit data rate voices is delivered to the destination. The radio channel of mobile is characterized by multi channel reception.

The received signal by receiver is not only LOS(line of sight) radio waves besides a lot of reflected radio waves can be received at different time intervals. The delay in signals is due to reflection of waves from hills, terrains, buildings etc.The waves which are reflected will cause interference that means they reflect each other which causes significant degradation of network performance. The wireless system such as mobiles and Tabs should be minimized from these effects. All these effects are overcome by orthogonal frequency division multiplexing system.

Working of OFDM:

• The transmitter converts the input data from serial stream to parallel sets. It contains symbol X_k for each carrier. A set of 4 data will be 1 1 1 1 -1 -1.
• If the transmission takes 4 seconds then than each piece of data has 1 second duration. OFDM sends the data one after another if the duration of the data is 4 seconds.
• If the communication length is high the transfer speed and quality become shorter. The delay caused in the multi path remains constant.
• OFDM is highly suitable for high speed communication because of IST restrictions. Because it avoids low speed data transmissions.
• OFDM channel has 128 to 2048 sub-carriers and can occupy bandwidth from 1.25 MHz to 20MHz.

Channel bandwidth	1.25MHz   2.5 MHz   5MHz       10MHz   20Mhz
No. of sub-carriers	128               256           512          1024        2048
Sub-carrier spacing Symbol Time Guard Time	11.16 KHz 100.8μs 11.2μs

 

 Transmitted signal x(n) : 

Where N= Total no. of sub-carrier

              K= Subcarrier index with K=0, 1, 2…. ….. …… …… N-1.

Download  Orthogonal Frequency Division Multiplexing Electronics Seminar Report for ECE Students.